1. Das Sharma, “On-Package Chiplet Innovations with Universal Chiplet Interconnect Express (UCIe): Challenges and Opportunities”, Opening Plenary Keynote, 2023 International Test Conference, Oct 10, 2023, Anaheim, CA
  2. Das Sharma, “PCI-Express®: Continued Journey of an Open Innovation Slot in all Computing Platforms Spanning Decades”, Keynote, IEEE CEDA International Conference on Intelligent Systems and Embedded Design, Dehradun, India, Dec 15, 2023
  3. Das Sharma, “On-Package Chiplet Innovations with Universal Chiplet Interconnect Express (UCIe): Challenges and Opportunities”, Opening Keynote, 2023 SNU-Samsung 2nd Workshop on CXL and UCIe, Dec 7, 2023, Seoul, South Korea
  4. Das Sharma, “ Universal Chiplet Interconnect ExpressTM (UCIeTM): An Open Interconnect Standard for Innovation with Chiplets”, Keynote, IBM- IEEE CAS/EDS AI Compute Symposium, Nov. 28, 2023, Yorktown Heights, NY
  5. Das Sharma, “Universal Chiplet Interconnect ExpressTM (UCIeTM): An Open Industry Standard for Chiplets”, Keynote at iMAPS All Asia Conference (IAAC), International Microsystems, Packaging, Assembly, and Circuits Technology (iMPACT) 2023 Conference, Taipei, October 23, 2023
  6. Das Sharma, “Chiplet Interconnect Express (UCIe)TM: An Open Standard Interconnect for Innovation”, Keynote, SiP Conference China 2023, Shenzhen, August 24, 2023
  7. Das Sharma, “Compute Express Link (CXL*): Shaping the Compute Landscape”, Keynote, IEEE Cool Chips 2023, April 2023, Japan
  8. Das Sharma, “Universal chiplet interconnect expressTM (UCIe™): Building an open ecosystem of chiplets for on-package innovations”, Keynote, Open Fabrics Alliance 2023 Virtual Workshop
  9. Das Sharma, “Universal Chiplet Interconnect ExpressTM (UCIeTM): On-Package Innovation Slot for Compute, Memory, and Storage Applications”, Keynote, 2023 SNIA Compute + Memory + Storage Summit, April 11-12, 2023, Virtual
  10. Das Sharma, “Compute Express LinkTM (CXLTM): Advancing the Next Generation of Memory Solutions”, Keynote, Memcon 2023, Mountainview, March 2023
  11. Das Sharma, “High-Bandwidth and Low-Latency Standardized Interconnect for an Open Chiplet Ecosystem”, Plenary talk at IEEE Heterogeneous Integration Roadmap (HIR) Workshop, Milpitas, Feb 2023. Identified as top 4 talks for membership to view https://r6.ieee.org/scv-eps/?p=3049.
  12. Das Sharma, “Compute Express Link (CXL*): Changing the Compute Landscape”, Opening Keynote, CXL Workshop by Seoul National University, February 16, 2023
  13. Das Sharma, “Compute Express Link (CXL*): Changing the Compute Landscape”, Distinguished Lecture, School of Information and Computer Science, Univ of California, Irvine, February 3, 2023
  14. Das Sharma, “UCIe™ (Universal Chiplet Interconnect Express™):Building an open ecosystem of chiplets for on-package innovation”, Keynote in NEPCON, Japan, Dec 2022
  15. Das Sharma, “Transforming the Data-Centric World”, Keynote, Flash Memory Summit, Santa Clara, CA, Aug 3, 2022. Extensive media coverage by Forbes, Business News, etc..
  16. Das Sharma, “Universal Chiplet Interconnect Express (UCIe): Poised to change the Compute Landscape”, Keynote, IEEE Cool Chips, Tokyo, April 2022
  17. Das Sharma, “Compute Express Link (CXL*): Changing the Compute Landscape”, CSL Spotlight Distinguished Lecture Series, Department of Computer Science, University of Illinois, Urbana-Champaign, April 22, 2022
  18. Das Sharma, “Compute Express Link (CXL*): Changing the Compute Landscape”, Distinguished Lecture, School of Computer Science, Carnegie Mellon University, April 6, 2022
  19. Das Sharma, “Compute Express Link (CXL*): Changing the Compute Landscape”, Distinguished Lecture, Department of Electrical and Computer Engineering, Texas A&M University, April 1, 2022
  20. Das Sharma, “Future challenges for on-package interconnects”, Opening Plenary Talk, IEEE 3DIC Conference, Nov 15, 2021, Raleigh, NC
  21. Das Sharma, “Innovations in Load-Store I/O causing Profound Changes in Memory, Storage, and Compute landscape”, keynote at Storage Developers Conference, SDC, Sept 28, 2021
  22. Das Sharma, “Compute Express Link (CXL)*: Changing the Industry Landscape”, Opening Keynote, in `Industry Leaders Present: CXL – Enabling New Capabilities in SoCs’, organized by Synopsys, Aug 31, 2021
  23. Das Sharma, “PCI Express® 6.0 at 64.0 GT/s with PAM-4 signaling: a low latency, high bandwidth, high reliability, and cost-effective interconnect”, IEEE Industry Distinguished Lecture Program
    1. IEEE CAS and SSCS San Diego Chapter, Aug 27, 2021
    2. IEEE CAS Atlanta Chapter, Oct 26, 2021
  24. Das Sharma, “The Compute Express Link (CXL)* open standard is changing the game for cloud computing”, Opening Keynote in IEEE Hot Interconnects, 2021, August 18, 2021. Press coverage by Serve the Home, blocksandfiles, and Next Platform.
  25. Das Sharma, “Innovations in Memory and Storage with PCI Express* and Compute Express Link*”, Keynote talk in Storage Developers Conference, SDC India, August 5. 2021
  26. Das Sharma, “Evolution of Load-Store I/O to meet the needs of Compute and Storage Infrastructure”, Keynote talk in Storage Developers Conference SDC EMEA 2021, June 8, 2021
  27. Das Sharma, “Evolution of Interconnects and Fabrics to support future Compute Infrastructure”, Opening Keynote in Open Fabrics Alliance Workshop, March 2021
  28. Das Sharma, “PCI Express® 6.0 at 64.0 GT/s with PAM-4 signaling: a low latency, high bandwidth, high reliability, and cost-effective interconnect”, Distinguished Lecture Series, Department of Computer Science, Texas A&M University, Feb 2021
  29. Das Sharma, “Innovations in I/O: Intel and IHV opportunity”, Keynote address in Intel Road Map Update (IRUM), Fall (Aug) 2018, in Intel, Jones Farm, OR