Dr. Debendra Das Sharma is an Intel Senior Fellow and co-GM of Memory and I/O Technologies in the Data Platforms and Artificial Intelligence Group at Intel Corporation. He is a leading expert on I/O subsystem and interface architecture.
Dr. Das Sharma is a member of the Board of Directors for the PCI Special Interest Group (PCI-SIG) and a lead contributor to PCIe specifications since its inception. He is a co-inventor and founding member of the CXL consortium, co-leads the CXL Board Technical Task Force, and is a leading contributor to CXL specifications. He co- invented the chiplet interconnect standard UCIe and is the chair of the UCIe consortium.
Dr. Das Sharma has a bachelor’s in technology (with honors) degree in Computer Science and Engineering from the Indian Institute of Technology, Kharagpur and a Ph.D. in Computer Engineering from the University of Massachusetts, Amherst. He holds 180+ US patents and 450+ patents world-wide. He is a frequent keynote speaker, plenary speaker, distinguished lecturer, invited speaker, and panelist at the IEEE Hot Interconnects, IEEE Cool Chips, IEEE 3DIC, SNIA SDC, PCI-SIG Developers Conference, CXL consortium, Open Server Summit, Open Fabrics Alliance, Flash Memory Summit, Intel Innovation, and Universities (CMU, Texas A&M, Georgia Tech, UIUC, UC Irvine). He has been awarded the Distinguished Alumnus Award from Indian Institute of Technology, Kharagpur in 2019, the IEEE Region 6 Outstanding Engineer Award in 2021, the first PCI-SIG Lifetime Contribution Award in 2022, and the IEEE Circuits and Systems Industrial Pioneer Award in 2022.